The following presentation on Xilinx power advantages, covers the key points I reviewed with the FAEs in January.

I will start by reviewing with everyone the basic conditions which are affected or directly controlled by power dissipation of a device. In addition to the common feel everyone has, that “Low power devices means less heat” we have four areas of system design which are affected by power.

The first two; performance and utilization are limited by the maximum amount of power a particular package can dissipate (which we will show in the next few slides).

Next package flexibility is directly affected because of the need to use expensive ceramic packages, some times with added heat sinks and fans, as the required power dissipation rises. Another key item which is affected is the power supply, which is directly affected by the power needed by the devices.

And device reliability is also greatly affected by the device junction temperature, as we will show later a rise in junction temperature will double the FIT rate for every 10 C.