 Application Notes
Application Briefs
|
Data
Book XCELL Articles
|
to view the 
PDF files below.
| Title | Size |
|---|---|
| Xilinx
Thermally Enhanced Packaging |
11 kB |
| Footprint
Compatibility Guide |
273 kB |
| Common
XC4000/XC5200 PC84 Footprint |
50 kB |
| Ball-Grid
Array Package Information |
43 kB |
| Pin
Preassigning with XC9500 CPLDs |
83 kB |
| Title | Size |
|---|---|
| XC4000E
Low Power Consumption: At High Speeds |
24 kB |
| PLDs,
Pins, and PCBs: The Importance of Pin-Locking and Footprint Compatibility
|
54 kB |
| XC9500
Pin Locking Capability and Benchmarks |
67 kB |
| Title | Size |
|---|---|
| Packages
and Thermal Characteristics |
237 kB |
| Individual
Package Drawings |
|
XC5202
Pinouts including VQ64 Package  |
14 kB |
Note: Device pinouts are found in the individual data sheets