Product Change Notification PCN95010

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December 18, 1995

Subject: Process Change Notification (PCN95010) - A New Manufacturer for the Xilinx Serial Configuration PROM's & Obsolescence of the Existing PROM Products.

Products Affected: All members of the XC1700D and XC1700L families of products.

Change Description: Xilinx intends to establish a new wafer fabrication facility for the Xilinx Serial Configuration PROM's. The new wafer fabrication facility is the Seiko wafer foundry in Fujimi, Japan. Parts from this facility will carry the designation XC1700E and XC1700EL. They are form, fit, and system compatible with the existing XC1700D and XC1700L devices, but will require a software update to your programming algorithms.

Reason For Change: This foundry change is being made to give Xilinx the ability to improve our future product roadmap and to facilitate development of new devices on an existing mainstream process.

Key Dates: We are trying to provide our customers with as much advanced notice of this change as possible. Engineering samples of the new PROM's and final qualification data will be made available according to the schedule below. We expect to start shipping the new Seiko parts on or before June 1, 1996. Last time orders for the older PROM's should be placed prior to July 1, 1996 with delivery prior to January 1, 1997.

Traceability: All existing XC1700D and XC1700L devices will be replaced by Seiko manufactured serial PROM's bearing the markings XC1700E and XC1700EL respectively.

Xilinx will be working with third party programmer manufactures as will as distributors to ensure a smooth transition to the new products. Immediate response to this notification is not required. Please note that the effective dates of this PCN were later modified by PCN95010A. Please consult PCN95010A or your Xilinx sales representative for more details. For any questions regarding this PCN you may contact Xilinx via email at "pcn@xilinx.com" or by FAX at 408-559-1368.

Joseph J. Fabula
Director Q/A