Xilinx Products

Packages and Thermal Characteristics

Text Information 
Individual Package Drawings 

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The Packages and Thermal Characteristics chapter of the Data Book is quite large. To make the information more accessible on the Web, this page provides links to the text information only and individual package drawings.

Text Information Only

pdf Packages and Thermal Characteristics - This document contains :

  • Number of Available I/O Pins
  • Package Options
  • Thermal Management
  • Package Thermal Characterization Methods & Conditions
  • Some Power Management Options
  • Component Mass (Weight) by Package Type
  • Xilinx Thermally Enhanced Packaging
  • Moisture Sensitivity of PSMCs
  • Tape and Reel
  • Reflow Soldering Process Guidelines
  • Sockets

    • Individual Package Drawings

    Plastic DIP Packages - pdf PD8, pdf PD48

    SOIC Packages - pdf SO8

    TSOP Packages - pdf VO8

    PLCC Packages - pdf PC20, pdf PC28, pdf PC44, pdf PC68, pdf PC84

    PQFP Packages - pdf PQ44, pdf PQ100, pdf PQ160, pdf PQ208, pdf PQ240, pdf PQ304, pdf HQ100, pdf HQ160, pdf HQ208, pdf HQ240, pdf HQ304

    TQFP Packages - pdf TQ44, pdf TQ100, pdf TQ144, pdf TQ176, pdf HT100, pdf HT144, pdf HT176

    VQFP Packages - pdf VQ44, pdf VQ64, pdf VQ100

    BGA Packages - pdf BG225, pdf BG352, pdf BG432

    Ceramic DIP Packages - pdf DD8

    Ceramic PGA Packages - pdf PG68, pdf PG84, pdf WG84, pdf PG120, pdf PG132, pdf PG144, pdf PG156, pdf PG175, pdf PG191, pdf PG223, pdf PG299, pdf PG411

    Ceramic Brazed QFP Packages - pdf CB100 (3k), pdf CB100 (4k), pdf CB164 (3k), pdf CB164 (3k), pdf CB196, pdf CB228

    CLCC Packages - pdf CC20

    Plastic PGA Packages - pdf PP132, pdf PP175

    Windowed CLCC Packages - pdf WC44, pdf WC68, pdf WC84

    Metal Quad Packages - pdf MQ208, pdf MQ240

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